- 15+ years experience in PCB design.
- Development of multi-layer printed circuit boards of high complexity (HDI, BGA, MicroVIA, Blind VIA,Controlled impedance board.)
- Familiar with the technique of high-speed signal routing (High speed designer), differential pairs, length control, length matching, no stub routing, etc (PCI, PCI-express, Ethernet, 10G Ethernet, SATA, SAS, IDE, USB3.0 , DDR, DDR2,DDR3, DDR4 etc.
- Experience with EMI and Crosstalk design and practices.
- Experience with High Speed design practices.
- Understanding of fabrication methods, film processing, board manufacturing and production techniques - including paste/reflow, wave solder, robotic assembly, SMD placement.
- Involved in the creation and maintenance of component libraries.
- Layer structure preparation (Stack-UP), parameters calculation to meet the impedance of conductors (Single, Differential impedance)
Proficient with Mentor Graphics Expedition PCB, Cadence Orcad, Cadence Allegro PCB, CAM350.